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$5M Metrology Order

Photonics Spectra
Apr 2010
Rudolph Technologies Inc. of Flanders, N.J., a process characterization equipment and software provider, has received $5 million worth of orders from a long-standing customer for its S3000A and MetaPulse III thin-film metrology systems. Expected to ship to multiple fabs in the first half of 2010, the systems will be used in copper metrology applications, including copper seed/barrier, electrochemical deposition and chemical mechanical polishing. The MetaPulse III can directly measure thickness and other metrology parameters on product wafers in the active device regions for accurate process control.

The science of measurement, particularly of lengths and angles.
Businesschemical mechanical polishingcoppercopper metrologyelectrochemical depositionlight speedMetaPulse IIImetrologymetrology orderRudolph TechnologiesS3000ASoftwareTest & Measurementthickness measurementthin film metrology systemthin filmsWafers

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