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AIM Photonics to Offer Optoelectronic Testing Services

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AIM Photonics has launched its new Opto-electronic Testing Services, which the institute said features a full suite of advanced tools for testing photonic integrated circuits (PICs) and conventional electronic ICs.

The service will be offered through AIM Photonics’ Test, Assembly, and Packaging (TAP) facility, which provides access to both photonic and electronic test, assembly, and packaging prototyping services for substrates up to 300-mm wafers, AIM said.

Chris Striemer, business development and facilities manager at AIM’s TAP facility, said the location’s comprehensive toolset enables the test and measure of multiple performance aspects of devices before and immediately after package assembly. This allows for rapid verification and optimization of the manufacturing process in the same R&D center, Striemer said, saving members and customers time and resources.
The large automated prober in AIM Photonics’ test lab enables programmable optical, DC and RF interrogation of wafer substrates as large as 300 mm, with additional flexibility for die-level testing. Courtesy of AIM Photonics.
The large automated prober in AIM Photonics’ test lab enables programmable optical, DC, and RF interrogation of wafer substrates as large as 300 mm, with additional flexibility for die-level testing. Courtesy of AIM Photonics.
AIM’s advanced Opto-electronic Testing Services currently includes more than 30 tools for passive optical, active optoelectronic, telecom/datacom, and radio frequency and direct current testing. The toolset offers a broad range of testing capabilities for on-wafer, die-level, and packaged devices.


“Providing access to these services is core to our mission to expand the silicon photonics ecosystem,” Striemer said.

AIM Photonics’ test and measurement capabilities will expand over the next several years through additional hardware and partnerships with Rochester-area colleges and universities, fueled by funding recently authorized through Empire State Development by the New York State Photonics Board.

“Our customers include not only small businesses, academics, and of course our government partners, but also research and development groups in companies — both large and small — that want to explore photonics without having to invest in testing infrastructure,” said Amit Dikshit, design enablement manager at AIM Photonics.

Photonics Spectra
Aug 2023
GLOSSARY
metrology
The science of measurement, particularly of lengths and angles.
wafer
A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
tap
A device for extracting a portion of the optical signal from a fiber.
BusinessTest & Measurementmetrologyopticswafersemiconductor300 mmAIM PhotonicsUnited StatesTAPTest Assembly PackagingoptoelectronicOpto-electronic Testing ServicesRochesterAmericasIndustry News

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