ASML, Imec to Establish a Joint Lab, Accelerate Adoption of EUV Lithography

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Research and innovation hub imec and lithographic equipment developer ASML have entered the next stage of their extreme UV (EUV) lithography collaboration.

Together, they will accelerate the adoption of EUV lithography for high-volume production, including the current latest available equipment, and establish a joint, high-numerical-aperture research lab. Moreover, they will explore the potential of the next-generation, high-numerical-aperture EUV lithography to enable printing of even smaller nanoscale devices advancing semiconductor scaling toward the post-3-nm logic node.

imec and ASML have been conducting joint research for almost 30 years. In 2014, they created the Advanced Patterning Center joint research facility to optimize lithography technology for advanced CMOS integration and to prepare the ecosystem to support advance patterning requirements. Now, they bring this cooperation to the next stage with the installation of ASML’s most advanced and high-volume production dedicated EUV scanner in imec’s cleanroom. Utilizing imec’s infrastructure and advanced technology platforms, imec and ASML researchers and partner companies can proactively analyze and solve technical challenges such as defects, reliability, and yield to accelerate the EUV technology’s industrialization.

Published: November 2018
Lithography is a key process used in microfabrication and semiconductor manufacturing to create intricate patterns on the surface of substrates, typically silicon wafers. It involves the transfer of a desired pattern onto a photosensitive material called a resist, which is coated onto the substrate. The resist is then selectively exposed to light or other radiation using a mask or reticle that contains the pattern of interest. The lithography process can be broadly categorized into several...
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