Close

Search

Search Menu
Photonics Media Photonics Marketplace Photonics Spectra BioPhotonics EuroPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook

PODIUM Consortium Will Develop Integrated Photonics Solution

Facebook Twitter LinkedIn Email Comments
Chip Integration Technology Center (CITC), Tegema, Physik Instrumente (PI), and PHIZ announced a photonics assembly consortium called PODIUM (PIC Open Development Infrastructure for Universal Markets). The consortium is funded by PhotonDelta and CITC.

The consortium runs a program in which optical termination technology, assembly, and packaging is developed for a wide range of integrated photonic applications. It aims to reduce barriers to adoption of integrated photonics technology by reducing costs — up to 80% of the total device cost lies in electrical and optical packaging. 

Photonics Spectra
Feb 2021
BusinesspackagingconsortiumPHIX Photonics Assemblyphotonics assembly consortiumChip Integration Technology CenterCITCPhysik InstrumentePhysik Instrumente (PI)TegemaPODIUMEuropelight speed

Comments
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2021 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, [email protected]

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.