Delft Circuits, a provider of high-density connectivity solutions for quantum computers, has released a roadmap overviewing and detailing its approach to overcoming dynamic bottlenecks related to scaling quantum compute solutions. The company’s Cri/oFlex cables, a scalable I/O solution that combines superconducting materials with filters and integrated attenuators in multichannel flex cables, are central to the approach. Cri/oFlex offers 8× higher density at the same price point per channel, with density set to increase to 32× within 18 months, according to the company. “In our work with the leading quantum computing companies, we are often asked how we intend to connect thousands of qubits as their quantum systems continue to grow,” said Daan Kuitenbrouwer, co-founder of Delft Circuits. “In response, we have created this roadmap, which highlights how we are addressing this crucial challenge” In completing the roadmap, Delft Circuits faces one major bottleneck: integrated testing at scale. To perfectly optimize a product for large-scale quantum computers, it must first undergo testing in an integration fashion, or inside the machine. Integrated testing provides the necessary feedback that can improve the product's performance. However, this requires building large-scale systems and benchmarking at scale. This task demands collaboration since Delft Circuits, the manufacturer, needs to test it on its clients’ systems. According to the company, the newly released roadmap marks the beginning of potential collaborations. Delft Circuits’ Cri/oFlex cables deliver 256 channels per compared to 168 channels for HD coax at, and at an advantageous price point, according to the company. These cables are superconducting, multichannel flex cables designed for cryogenic environments, using filters and attenuators to maintain high signal quality. The cable’s design delivers between 5-20× fewer failure points compared to coax and HD coax systems, which reduces cost per operation and minimizes downtime. The solution additionally uses a flat cable design, which enables it to accelerate faster thermalization with lower heat load. For the highest density quantum, I/O in the 256 channels, the company said that it plans to increase density fourfold every two years, reaching 1024 channels per loader in 2027 and 4096 in 2029. Maintaining low crosstalk, noise, and thermal load while increasing channel density enables advanced quantum error correction techniques, contributing to high signal integrity. The company has cited the possibility of a few unknowns that may disrupt meeting the road map targets; for example, if quantum modalities change, such as if spin qubits become more powerful than superconducting qubits, the type of I/O clients are asking for may change. The need to adapt to and address potential forthcoming developments in chiplets and multiplexing is another challenge since the time of its creation is still an unknown. Past 2029, Delft Circuits will focus on improving quantum computing by using many qubits with very high quality and need smooth integration without overloading the cryostat. To directly share developments with customers, Delft Circuits has launched a U.S. customer roadshow; the company will use the platform to engage with industry leaders on roadmap deliverables and future alignment. Through the roadshow, the company intends to share with the market that it enables scalability for quantum hardware.