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Development Pact to Enhance Semiconductor Packaging

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GARCHING, Germany, Feb. 3, 2014 — A joint development agreement between SÜSS MicroTec and IBM Corp. has been extended to further develop technologies in advanced semiconductor packaging.

SÜSS MicroTec Photonic Systems Inc., a subsidiary of SÜSS MicroTec, recently installed the ELP300 excimer laser stepper system at IBM, which will enhance and propel the application of such technologies in areas including 3-D systems integration.

The effort will leverage IBM’s packaging expertise and SÜSS MicroTec Photonic Systems’ 24 years of excimer laser processing and tool development to create innovative packaging and to enable higher-performance materials for the semiconductor back end.

“We see high growth potential for this technology and continue contributing to the development of alternative manufacturing processes,” said Frank P. Averdung, president and CEO of SÜSS MicroTec.

The excimer laser process extends capability beyond traditional manufacturing approaches while potentially lowering costs. The program will focus on seed layer removal for under bump metallization and on microstructuring organic dielectrics for system interconnects.

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Feb 2014
advanced packagingBusinessEuropeFrank P. AverdungGermanyIBMindustrialResearch & TechnologySüss MicroTecSÜSS MicroTec Photonic SystemsELP300excimer laser stepper3-D systems integrationseed layer removalunder bump metallizationmicrostructuring organic dielectricslasers

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