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Dow Corning Establishes Thin Film Technology Platform
Jan 2002
MIDLAND, Mich., Jan. 30 -- Dow Corning Corp. recently launched a new program, the Thin Film Technology Platform, to identify, develop and promote new products based on thin-film materials and processes.

The platform was established to support and serve the company's high-growth electronics and new ventures business units, which include efforts in energy, photonics, plasma, flat panel displays, semiconductor device fabrication and packaging. The program aims to identify high-value applications for next-generation, silicon-based thin films, to develop process chemistry, to characterize film performance and to integrate high-volume deposition processes technology. The effort is supported by a state-of-the-art thin-film characterization laboratory in Midland and a worldwide team of researchers.

"The Thin Film Technology Platform is a critical step to establishing the foundation for long-term growth and leadership in high-technology businesses, and I am honored for the opportunity to direct this effort," said Mark Loboda, associate research scientist and team leader for Dow Corning's Thin Film Technology Platform. "This platform unifies the resources, expertise and technology needed to successfully create and execute the delivery of new high- value products to the marketplace."

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