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EVG Unveils New Wafer Bonder

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ST. FLORIAN, Austria, July 27, 2010 — EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced that it has introduced the EVG560HBL wafer bonder. According to the company, it’s the industry’s first fully automated wafer bonding system for high-brightness light-emitting diode (HB-LED) manufacturing.

The system features a new design for multisubstrate bonding and is capable of throughput rates of 160 bonds per hour. It is optimized to meet the requirements of HB-LED manufacturers with the automation capabilities that they will need to increase their production capacity and yields, EVG said.

The HB-LED market continues to grow at a rapid pace because of the rising number of applications that can take advantage of the lower energy consumption and myriad other benefits of LED devices. According to market research firm Strategies Unlimited of Mountain View, Calif., the HB-LED market will grow from $8.2 billion in 2010 to $20.2 billion by 2014, driven mainly by the market for LCD display backlights and lighting applications.

To meet this increased demand, manufacturers must ramp up production capacity as well as optimize processes to ensure the highest yields, especially critical for the wafer bonding process that is needed to transfer the active LED layer from epitaxial substrates onto carrier wafers with thermal properties better suited for HB-LED devices.

The EVG560HBL offers a number of capabilities to enable high-volume HB-LED manufacturing, the company said.

For more information, visit:
Jul 2010
The use of atoms, molecules and molecular-scale structures to enhance existing technology and develop new materials and devices. The goal of this technology is to manipulate atomic and molecular particles to create devices that are thousands of times smaller and faster than those of the current microtechnologies.
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