EV Group to Expand Production Capacity
FLORIAN, Austria, June 19, 2017 — EV Group, a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria.
Representing a $22 million (€20 million) investment, the expansion will include the construction of a new building that provides additional production and test capacity for equipment that meets the high cleanliness requirements of the semiconductor industry and allows for a significant expansion of warehouse space.
"With the new building adjacent to our existing manufacturing facilities, we will first and foremost create additional test rooms for the final assembly, software installation and quality assurance of our equipment and the technical source inspection by our customers," said Werner Thallner, executive operations and financial director at EV Group. "This enables us to act on the significant increase in demand for our solutions in both existing and new markets, and pursue our mid- and long-term growth targets at the same time."
The new building is set to open before the end of the calendar year.
EV Group is a supplier of wafer bonding, thin-wafer processing, lithography/nanoimprint lithography and metrology equipment, as well as photoresist coaters, cleaners and inspection systems for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
https://www.photonics.com/Buyers_Guide/EV_Group_EVG/c4622