Search Menu
Photonics Media Photonics Buyers' Guide Photonics Spectra BioPhotonics EuroPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook
More News

Finisar, 3S Photonics, Partner on Laser Packaging Platform

Facebook Twitter LinkedIn Email Comments
NOZAY, France, and SUNNYVALE, Calif., March 13, 2013 — Optical communication components suppliers 3SPhotonics and Finisar Corp. have teamed up to develop a packaging platform for 980-nm cooled-laser pump modules.

3S Photonics will be the exclusive supplier of the 980-nm laser chips used for the platform, and Finisar will implement a manufacturing line based on this platform in its newly expanded Wuxi, China, facility. Finisar will use the pump modules in its erbium-doped fiber amplifier and Line Card telecom products; 3S Photonics will use the platform to serve its customers.

The partnership will give 3S Photonics “access to an alternative competitive packaging platform that will improve the fixed-cost absorption of our wafer fab,” said Alexandre Krivine, CEO of 3SPGroup.

The modules are expected to be available by mid-2013.

For more information, visit: or
Mar 2013
optical communications
The transmission and reception of information by optical devices and sensors.
3S PhotonicsAlexandre KrivineAmericasAsia-PacificBusinessCaliforniaChinaCommunicationsEitan GertelEuropeFinisarFranceindustriallaser pump modulesoptical communicationsopticstelecommunicationsWafers

back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2019 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,

Photonics Media, Laurin Publishing
x We deliver – right to your inbox. Subscribe FREE to our newsletters.
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.