Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn Comments

JSR Joins Sematech at UAlbany NanoCollege
May 2010
ALBANY, N.Y., and TOKYO, May 12, 2010 — In a collaboration aimed at providing cost-effective semiconductor materials for 22-nm nodes, JSR Corp.’s US operation, JSR Micro, has joined Sematech, a global consortium of chipmakers, at the College of Nanoscale Science and Engineering (CNSE) of the University of Albany.

JSR will collaborate with Sematech’s Resist Materials and Development Center (RMDC) engineers on key resist issues in extreme ultraviolet (EUV) lithography. Focus areas will include: 

    • Working to reduce or eliminate line edge roughness in lithographic images below 22 nm. 
    • Discovering ultimate resolution of newly formulated photoresists. 
    • Testing various imaging materials for EUV sensitivity.

Sematech and JSR have partnered in several technology development programs, including 300-mm test wafers, low-k films and advanced resists (double-exposure materials).

“We have a successful history of partnership with Sematech, and we are excited to continue that history in the field of EUV,” said Hozumi Sato, managing director of JSR, who is responsible for the research and development. “Combining resources to create next generation of EUV materials is not only good for JSR and Sematech but will benefit the industry as a whole."

“We’re looking forward to working with JSR in our mutual effort to develop leading-edge resists and materials and accelerate process availability for EUV pilot line manufacturing,” said John Warlaumont, vice president of Advanced Technology at Sematech. “Our successful experience in our previous partnerships will contribute greatly to RMDC’s effectiveness.”

“The addition of JSR to the roster of global companies at CNSE’s Albany NanoTech Complex will further enhance the Sematech-CNSE partnership in driving leading-edge nanoelectronics innovations,” said Richard Brilla, CNSE vice president for Strategy, Alliances and Consortia. “This collaboration is enabling advances in a host of technologies, including EUV lithography, which are critical to industry.”

For more information, visit: 

The use of atoms, molecules and molecular-scale structures to enhance existing technology and develop new materials and devices. The goal of this technology is to manipulate atomic and molecular particles to create devices that are thousands of times smaller and faster than those of the current microtechnologies.
300 mm test wafersadvanced resistsAmericasAsia-PacificBusinesschipmakersCNSECollege of Nanoscale Science and EngineeringEUV materialsextreme ultarviolet lithographyHozumi Satoimaging materialsindustrialJohn WarlaumontJSRlow-k filmsnanonanoelectronicsnanotechnologyphotoresistsResist Materials and Development CenterRichard BrillaSematechTokyoUniversity of Albany

Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,

Photonics Media, Laurin Publishing
x We deliver – right to your inbox. Subscribe FREE to our newsletters.
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.