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Nanofabrication Facility Taps EV Group

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ST. FLORIAN, Austria, March 18, 2010 – EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF). Supported by the National Science Foundation, the LNF is a research center for MEMS and Microsystems and is a member of the National Nanotechnology Infrastructure Network (NNIN).

With a wafer bonder and aligner already installed at the facility, these new systems will increase the level of the university's overall MEMS research efforts by providing high-force wafer bonding capabilities, said EVG.

The bonding systems – an EVG520IS and an EVG510 – are undergoing installation with completion targeted for Q1 this year. The wafer bonders will be used for a wide-range of MEMS-related research in fields such as biomedical, environmental and optoelectronics.

"As a member of NNIN, we are always looking for the most advanced technical processing capabilities – not only for our own research efforts, but also in the interest of other research groups dedicated to advancing MEMS technology," said Ken Wise, professor at the University of Michigan and director of the LNF.

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Mar 2010
The use of atoms, molecules and molecular-scale structures to enhance existing technology and develop new materials and devices. The goal of this technology is to manipulate atomic and molecular particles to create devices that are thousands of times smaller and faster than those of the current microtechnologies.
A sub-field of photonics that pertains to an electronic device that responds to optical power, emits or modifies optical radiation, or utilizes optical radiation for its internal operation. Any device that functions as an electrical-to-optical or optical-to-electrical transducer. Electro-optic often is used erroneously as a synonym.
AmericasbiomedicalBusinessEV GroupindustrialKen WiseLurie Nanofabrication FacilityMEMSnanonanofabricationnanotechnologyNational Nanotechnology Infrastructure NetworkNational Science FoundationopticsoptoelectronicssemiconductorsUniversity of Michiganwafer bonding systemsWafers

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