EV Group, supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has shipped two wafer bonding systems to the University of Michigan's Lurie Nanofabrication Facility (LNF). Supported by the National Science Foundation, the LNF is a research center for MEMS and Microsystems and is a member of the National Nanotechnology Infrastructure Network (NNIN). With a wafer bonder and aligner already installed at the facility, these new systems will increase the level of the university's overall MEMS research efforts by providing high-force wafer bonding capabilities, said EVG. The bonding systems – an EVG520IS and an EVG510 – are undergoing installation with completion targeted for Q1 this year. The wafer bonders will be used for a wide-range of MEMS-related research in fields such as biomedical, environmental and optoelectronics. "As a member of NNIN, we are always looking for the most advanced technical processing capabilities – not only for our own research efforts, but also in the interest of other research groups dedicated to advancing MEMS technology," said Ken Wise, professor at the University of Michigan and director of the LNF. For more information, visit: www.evgroup.com