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Optoelectronics Packaging Programs Funded at RIT

Photonics Spectra
Dec 2002
The Center for Electronics Manufacturing and Assembly at Rochester Institute of Technology has received financial backing for two optoelectron-ics packaging programs. The Infotonics Technology Center of Rochester has invested $120,000 for a project involving the characterization of assembly materials, substrates and processes for packaging that combines optics and electronics into integrated devices. The Society of Manufacturing Engineers will provide $249,284 for a four-course optoelectronics packaging curriculum and laboratory project.

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