CANTON, Mass., June 11 -- Robotic Vision Systems Inc. has received an order for a WS-2510 bumped wafer inspection system from a Taiwan producer of wafer-level packaging solutions. The system will be used for 2-D surface defect inspection as well as for 3-D metrology on gold and solder bumps and will be installed at the company's new bumping facility in Hsin-Chu Hsien, Taiwan. "This order had special significance to us because the customer required a single inspection tool that was sufficiently versatile to cover an extremely broad range of inspection applications encompassing 3-D metrology and 2-D surface inspection on both gold and older bumps," said Michael Gray, the Semiconductor Equipment Group's vice president of sales.