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RVSI Wins Taiwan Order for Wafer Inspection System

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CANTON, Mass., June 11 -- Robotic Vision Systems Inc. has received an order for a WS-2510 bumped wafer inspection system from a Taiwan producer of wafer-level packaging solutions. The system will be used for 2-D surface defect inspection as well as for 3-D metrology on gold and solder bumps and will be installed at the company's new bumping facility in Hsin-Chu Hsien, Taiwan.

"This order had special significance to us because the customer required a single inspection tool that was sufficiently versatile to cover an extremely broad range of inspection applications encompassing 3-D metrology and 2-D surface inspection on both gold and older bumps," said Michael Gray, the Semiconductor Equipment Group's vice president of sales.
Jun 2002
The science of measurement, particularly of lengths and angles.
metrologyNews & Features

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