OXFORDSHIRE, England, Sept. 12 -- Bookham Technology plc, a provider of optical components, modules and subsystems for fiber optic communication networks, announced it has consolidated its wafer fab facility in Ottawa, Canada, into its Caswell, England, facility as part of its cost reduction plans. As a result of this restructuring, the Ottawa fab has completed building its chip inventory, the company said. Bookham said approximately 75 percent of the 200 employees at the Ottawa facility have left the company, and the rest are expected to "transition out" as they gradually complete fab...Read full articleRelated content from Photonics MediaArticlesTeam Deepens Understanding of IC-PIC Integration's Thermal PenaltyCo-packaged optics for high performance computing and other data center applications require dense integration of silicon PICs with electronic integrated circuits (EICs). 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