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Chip Rotation Doesn't Disorient Vision System

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Daniel C. McCarthy

Imaging integrated circuits is a simple enough task for today's machine vision technology, but problems emerge when a vision system also must identify microscopic details on slightly skewed dies at near-blinding speeds. It is not uncommon for today's wire bond machines to attach dies with pad pitch sizes as small as 50 µm. Identifying wire bond leads by geometric pattern matching rather than gray-scale correlation enabled one wire bond machine to locate dies and calculate their rotation using only one alignment point. The increased rate of analysis translated into 12 percent faster...Read full article

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