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Development Pact to Enhance Semiconductor Packaging

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GARCHING, Germany, Feb. 3, 2014 — A joint development agreement between SÜSS MicroTec and IBM Corp. has been extended to further develop technologies in advanced semiconductor packaging. SÜSS MicroTec Photonic Systems Inc., a subsidiary of SÜSS MicroTec, recently installed the ELP300 excimer laser stepper system at IBM, which will enhance and propel the application of such technologies in areas including 3-D systems integration. The effort will leverage IBM’s packaging expertise and SÜSS MicroTec Photonic Systems’ 24 years of excimer laser processing and tool development to create...Read full article

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    Published: February 2014
    advanced packagingBusinessEuropeFrank P. AverdungGermanyIBMindustrialResearch & TechnologySüss MicroTecSÜSS MicroTec Photonic SystemsELP300excimer laser stepper3-D systems integrationseed layer removalunder bump metallizationmicrostructuring organic dielectricsLasers

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