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EU Invests €15.5M in Photonic Packaging Pilot Line

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CORK, Ireland, April 11, 2017 — To provide Europe with infrastructure to support the industrial development and manufacture of photonic integrated circuits (PICs), the European Union is investing €15.5 million ($16.4 million) in a new international consortium led by the Tyndall National Institute called Pixapp. Prof. Peter O'Brien, Head of Photonics Packaging Research at Tyndall National Institute, is leading the PIXAPP Consortium. Courtesy of Tyndall National Institute. “The consortium involved in Pixapp, led by Tyndall, has an unmatched record of excellence in delivering many world firsts in...Read full article

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    Published: April 2017
    Businessphotonic integrated circuitsEuropean UnionTyndall National InstitutePIXAPPPhotonic Packaging Pilot LineEuropeResearch & TechnologyEuro News

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