Close

Search

Search Menu
Photonics Media Photonics Marketplace Photonics Spectra BioPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook

IBM, EVG Partner for Laser Debonding Technology

Facebook Twitter LinkedIn Email
Tech company IBM and the EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, have signed a license agreement for laser debonding technology. EVG plans to integrate IBM’s patented Hybrid Laser Release process into its temporary bonding and debonding equipment solutions to provide high-volume manufacturers with the flexibility to implement optimized process flows. "This agreement with IBM enables EVG to provide a comprehensive and flexible technology offering to our high-volume production customers that...Read full article

Related content from Photonics Media



    ARTICLES


    PRODUCTS


    PHOTONICS HANDBOOK ARTICLES


    WHITEPAPERS


    WEBINARS


    PHOTONICS DICTIONARY TERMS


    MEDIA


    PHOTONICS BUYERS' GUIDE CATEGORIES


    COMPANIES

    LATEST HEADLINES
    view all
    PHOTONICS MARKETPLACE
    Search more than 4000 manufacturers and suppliers of photonics products and services worldwide:

    back to top
    Facebook Twitter Instagram LinkedIn YouTube RSS
    ©2022 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, [email protected]

    Photonics Media, Laurin Publishing
    x Subscribe to Photonics Spectra magazine - FREE!
    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.