An addition to the Microelectromechanical Systems series, the 221-page book Post-Processing Techniques for Integrated MEMS details how to merge the systems with their driving, control and signal processing electronics using pre-, interleaved or postprocessing. Chapters address such areas as maximum postprocessing temperature, silicon germanium as a suitable systems material and low thermal budget techniques for enhancing crystallization. Charts, diagrams, references, an index and a list of acronyms are included. Sherif Sedky; Artech House Inc., Norwood, Mass., 2006; $99.