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Integrated Fabrication Process Demonstrated for Metal-Oxide EUV Photoresist

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LEUVEN, Belgium, March 8, 2016 — The first integrated patterning process for next generation high-resolution devices using a nonchemically amplified metal containing photoresist and EUV lithography has been presented by nanoelectronics research center imec along with EUV photoresist developer Inpria Corp. of Corvallis, Ore., and Tokyo Electron Ltd. (TEL) of Tokyo, a semiconductor/flat panel display production equipment company. A novel metal-oxide photoresist-based fabrication method has been demonstrated for material patterning. Courtesy of imec. The novel metal-oxide photoresist-based method enables a significant...Read full article

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