Search
Menu
Cognex Corp. - Smart Sensor 3-24 GIF LB

Lasers Target Chip Fabrication

Facebook X LinkedIn Email
Smaller devices, thinner wafers and low-k dielectrics spell higher performance for semiconductor chips and emerging opportunities for laser processing tools.

Andrew Masters, Coherent Inc.

In semiconductor manufacturing, the drive to pack more functionality into ever-smaller spaces will ultimately fuel more aggressive chip designs, necessitating use of new low-k dielectric materials, wafer-level packaging, increasingly complex device layers and thinner wafers. All of these solutions will advance chip performance — and introduce new problems for the manufacturing process. Lasers become more viable machining tools wherever the semiconductor industry implements thinner wafers. These images of a 216-μm-thick silicon wafer, taken with a scanning electron microscope, shows...Read full article

Related content from Photonics Media



    Articles


    Products


    Photonics Handbook Articles


    White Papers


    Webinars


    Photonics Dictionary Terms


    Media


    Photonics Buyers' Guide Categories


    Companies
    Published: December 2003
    chip designsdielectric materialsFeaturesindustrialMicroscopythinner waferswafer-level packaging

    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.