SUNNYVALE, Calif., Jan. 30 -- MegaSense Inc., developer of integrated photonic micromodules and microsubsystems, announced it has completed its state-of-the-art MEMS wafer fabrication facility and has been awarded its first patent that covers broad MEMS wafer-level packaging processes. The facility, located at the company's headquarters in Sunnyvale, Calif., is a critical step in the company's strategy to independently produce its products, a key requirement for telecommunications customers, the company said. The patent and MegaSense's patent-pending portfolio cover a technology platform based on the company's System Approach for commercializing MEMS. The System Approach was developed and refined, through commercial manufacturing of MEMS products in high volume, by Vladimir Vaganov, MegaSense founder and CEO. "With $10 million in funding from Bay Partners and TPG Ventures, an executive team that possesses more than 75 years of experience in the commercialization of high-volume MEMS, photonics and electronics products, and a team named in nearly 100 patents, MegaSense is poised to play a defining role in establishing a new era of photonics," the company said.