Austin Richards, Flir Systems, Indigo OperationsJon Lesniak, Stress PhotonicsGavin Horn, University of IllinoisSilicon wafers are the fundamental building blocks of the microelectronics industry. The size of those used in fabricating integrated circuits has steadily increased because larger wafers yield more parts per processing step. As wafers grow to 300 mm in diameter and beyond, they become increasingly fragile and prone to stress buildup during manufacture. Residual stress accumulates during the growth, sawing, lapping/grinding, etching and polishing operations before the wafer has even begun the processing stages necessary for integrated circuit manufacture. 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