Search
Menu
PowerPhotonic Ltd. - Coherent Beam 4/24 LB

Novel Bonding Technology Improves Optical Assemblies

Facebook X LinkedIn Email
Trey Turner, REO, and Patrick Casnedi, Consultant

Activated covalent bonding overcomes the optical performance and laser damage limitations of traditional adhesive techniques and also can be used with mid-IR components. Optical components and assemblies in which elements are bonded together using UV-curing adhesives are widely employed in many laser applications. But traditional adhesive bonding technology does have some significant limitations in terms of the optical performance, laser damage characteristics and environmental attributes it delivers. A novel technique called activated covalent bonding (ACB) responds to the need for...Read full article

Related content from Photonics Media



    Articles


    Products


    Photonics Handbook Articles


    White Papers


    Webinars


    Photonics Dictionary Terms


    Media


    Photonics Buyers' Guide Categories


    Companies
    Published: March 2013
    Glossary
    adhesive
    An intermolecular substance that serves to hold materials together. Two types are used in the optical industry: one, which must be transparent and colorless, to cement lenses together; and a general-purpose adhesive for bonding prisms and other glass parts to their metallic supports.
    laser damage
    A natural or mechanical system adversely affected by the influence of laser radiation. During laser damage the common effect of the radiation on the surface of interest is heat accumulation due to absorption of the incident light by the incident material.
    ACBactivated covalent bondingadhesiveBasic SciencebondingchemicalsCoatingsdefenseEuropeFeaturesindustriallaser damageMicroscopymid-IRoptical assembliesOpticsPatrick CasnediREOTrey TurnerUV curing

    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.