Integrated photonics component supplier Optoscribe Ltd. has announced a multimillion-pound procurement agreement to supply transceiver optical interconnect chips, in volume, to a global Tier 1 optical networking supplier for its photonic integration projects that address the growing datacenter interconnect market. Optoscribe will deliver a range of photonic components integrated into a single monolithic glass chip, allowing the customer to quickly ramp its product to volume manufacturing. “This agreement is great news for the company and further endorses our unique 3D glass waveguide interface technology that enables simple coupling of fiber to active elements such as arrays of lasers and photodiodes in optical transceivers,” said Nick Psaila, CEO of Optoscribe. “This contract underpins our commitment to component manufacturing for the datacenter market, and we are well placed to grow rapidly in line with demand.” Optoscribe uses laser direct-write technology to manufacture glass-based integrated photonic components for the telecommunications and data communications markets. “The company has provided a good technical solution that is cost-effective and improves performance and we are very excited to be a key supplier partner to our customer, who is at the forefront of providing optical solutions that advance next-generation networks for content delivery in the fast growing hyperscale datacenter market,” said Steve McMahon, chief commercial officer of Optoscribe.