PHIX Photonics Assembly and PIXAPP Pilot Line coordinator Tyndall National Institute are collaborating to provide dedicated training to PHIX engineers on Tyndall’s advanced packaging equipment. This knowledge exchange could strengthen the photonics ecosystem in Europe and ensure open access to high-volume photonic integrated circuit (PIC) packaging through the PIXAPP Pilot Line. PHIX Photonics Assembly engineers visiting Tyndall’s packaging laboratories for training on advanced packaging technologies and to learn about packaging design rules. Courtesy of PHIX Photonics Assembly. LioniX International, a partner in the PIXAPP Pilot Line, will provide PIXAPP with access to a new high-volume assembly line for customers who have accessed the Pilot Line and are ready to move to the next stage. PHIX will provide state-of-the-art infrastructure in the Netherlands, supporting the European and worldwide industrial development of PICs. Both PHIX and Tyndall will actively supply engineering resources to support the further development of packaging and assembly processes. PHIX will standardize key process and assembly steps with the support of Tyndall. “Offering packaging services requires both processing and state-of-the-art equipment knowledge,” said Albert Hasper, CEO of PHIX. ”With Tyndall, we have found a partner that has a broad range of processing knowledge for PIC assemblies complementary to our expertise.” “We are delighted to support PHIX in the development of volume packaging processes and to provide comprehensive training to its staff,” said Peter O’Brien, director of the PIXAPP Pilot Line at Tyndall. “A key objective of PIXAPP is to build the integrated photonics ecosystem, establishing a volume manufacturing capability in Europe. Our focus on packaging design rules helps achieve this objective, ensuring efficient and scalable assembly processes," said O'Brien. "We plan to train PHIX engineers on the principles of these design rules, and how to implement them to build complex integrated photonic assemblies.” PHIX provides photonic assembly services targeting high-volume PIC applications. The company focuses on a hybrid platform, consisting of two or more different chips assembled in a planar configuration and coupled to optical fibers. The PICs are fabricated on indium phosphide or silicon substrates. This hybrid platform supports a wide range of applications. PIC-based photonics impact high-speed fiber optic communications, medical diagnostic sensors, the control of self-driving cars and emerging mass markets in the Internet of Things. As the speed and usage of day-to-day communication technologies continues to move toward peak levels, PICs will play an increasingly important role in addressing mass market requirements in communications, healthcare and security.