Remtec Inc. has completed the installation of a state-of-the-art gold-tin plating line and associated process control and quality assurance equipment. The new line provides the company with complete integrated in-house ability to produce high-quality laser diode submounts with Zero Pullback copper metallization and selective gold-tin finish, as well as ceramic substrate packages and packaging components with gold-tin finish. Remtec’s new gold-tin plating line provides completely integrated in-house ability to economically produce high-quality laser diode submounts with Zero Pullback copper metallization and selective gold-tin finish. (Photo: Remtec) The gold-tin plating process production, statistical process controls and quality control equipment have raised the company’s quality levels. Its quality control equipment includes x-ray fluorescence, energy dispersive x-ray fluorescence and a spectrophotometer, which allows for fast, accurate control and record of critical parameters such as gold-tin composition and thickness distribution. Its plating line includes gold-tin alloys with compositions varying from 72/28 to 80/20, with thickness specified between 3 and 50 µm. Substrates are available with multiple metallization techniques and selective plating options that permit both silver thick-film and TiW thin-film seed layers of various thicknesses, plated copper from 5 to 75 µm and NiAu finish with gold thickness from 0.1 to 2.5 µm. Ceramic and copper surface finishes also are available and can be held to Remtec provides custom and semicustom ceramic packaging based on plated copper and thick film (PCTF) technology. For more information, visit: www.remtec.com