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Rudolph Lithography System Ordered by Asian Automotive Company

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WILMINGTON, Mass., June 19, 2017 — Rudolph Technologies Inc. will ship its JetStep S Lithography System to an outsourced assembly and test facility in Asia for the production of system-in-package (SIP) products that combine sensor, processor and memory functions for the automotive industry. “Inherently large in size with a rectangular form factor, a SIP is ideally suited for panel manufacturing,” said Rich Rogoff, vice president and general manager of Rudolph’s lithography systems group. “Panels can accommodate a higher number of SIPs, which reduces the cost of manufacturing advanced packages due...Read full article

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