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Hamamatsu Corp. - Earth Innovations LB 2/24

Rudolph Receives First Order for Macro Defect Inspection System

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FLANDERS, N.J., June 15, 2011 — Rudolph Technologies Inc. has announced that it has received from an IC manufacturer the first order for its NSX 320 automated macro inspection system, designed for advanced packaging processes that use through silicon vias (TSV) to connect multiple die in a single package. The system provides critical inspection capabilities for edge-trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames and other TSV-related processes. It incorporates proprietary XSoft system software capabilities — including high-speed staging, on-the-fly image capture and a...Read full article

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    Published: June 2011
    Glossary
    metrology
    Metrology is the science and practice of measurement. It encompasses the theoretical and practical aspects of measurement, including the development of measurement standards, techniques, and instruments, as well as the application of measurement principles in various fields. The primary objectives of metrology are to ensure accuracy, reliability, and consistency in measurements and to establish traceability to recognized standards. Metrology plays a crucial role in science, industry,...
    Americasautomated macro inspection systembonding processesbumpingBusinessdata analysis systemdefect detectiondefect inspectiondicingedge-trimming metrologyfilm framesIC manufacturerimage captureImagingindustrialinspection systemintegrated circuit manufacturingmacro defect inspectionmetrologymicroelectronicsNew JerseyNSX 320NSX seriesobjectivespackaging processesprobingprocess control metrologyRudolph Technologiessawn waferssemiconductorsSensors & DetectorsSoftwarestagingTest & Measurementthrough silicon viasTSVwafer alignmentwafer manufacturingXSoft system software

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