Search
Menu
Cognex Corp. - Smart Sensor 3-24 GIF LB

Semiconductor Collaboration

Facebook X LinkedIn Email
An agreement to expand access to the 3M Wafer Support System equipment has been signed by 3M of St. Paul, Minn., and Suss MicroTec of Garching, Germany. The German company will become an authorized equipment supplier for the 3M system, which temporarily bonds the ultrathin wafers required for 3-D packaging. Suss MicroTec also will manufacture and sell wafer bonders designed to use 3M’s materials.Read full article

Related content from Photonics Media



    Articles


    Products


    Photonics Handbook Articles


    White Papers


    Webinars


    Photonics Dictionary Terms


    Media


    Photonics Buyers' Guide Categories


    Companies
    Published: September 2009
    3-D packaging3M3M Wafer Support SystembondBusinessequipment supplierImaginglight speedsemiconductorsSuss MicroTecultrathin wafers

    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.