CEA-Leti and !%SPP Process Technology Systems%! of Grenoble, France, and Tokyo, respectively, have announced their partnership to develop 300-mm through-silicon via (TSV) 3-D integrated circuit processes at CEA-Leti’s company’s facilities in France. The partners will research alternative hardware and processes to address the need for new, cost-effective methods for via fill. In addition, the agreement defines their collaboration on a range of 3-D TSV processes that optimize the etch and deposition technologies used to create high-aspect-ratio TSVs.