The Superfast 4G+ inspection system from Ultratech Inc. has been selected by a leading foundry for the development of its 3D inspection and process control of its FinFET processes. Patented coherent gradient sensing technology enables the use of a single type of 3D wafer inspection tool to economically measure patterned wafers across the entire fabrication line. "It is exciting to see Superfast being selected by this leading foundry,” said David Owen, chief technology officer for inspection systems at Ultratech. “The cargo inspection system technology is the best equipped in providing the low cost, 3D process control capabilities required by advanced foundry FinFETs. Superfast 4G+ inspection system provides a high throughput of 150 wafers per hour with a low cost of ownership compared to competing systems. The direct, front-side 3D topography measurement capability is well suited for patterned wafer applications such as lithography feed-forward overlay distortion and edge-defocus control, as well as thin-film deposition stress and planarization control. It delivers double the performance with fleet matching total measurement uncertainty, along with the ability to measure opaque and transparent stacks on patterned wafers. “Combining 3D structures with high-temperature annealing requires the inline 3D topography and stress control in which Superfast excels,” Owen said. “This foundry partnership and the ability to customize our algorithm to FinFET requirements led to this selection. I look forward to our FinFET process control collaboration and the development of new inspection modes." Ultratech designs, builds and markets manufacturing systems for the global technology industry, serving front-end semiconductor, back-end semiconductor and nanotechnology markets.