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Remtec Adds New Plating Line
Dec 2010
NORWOOD, Mass., Dec. 21, 2010 — Remtec Inc. has completed the installation of a state-of-the-art gold-tin plating line and associated process control and quality assurance equipment.

The new line provides the company with complete integrated in-house ability to produce high-quality laser diode submounts with Zero Pullback copper metallization and selective gold-tin finish, as well as ceramic substrate packages and packaging components with gold-tin finish.

Remtec’s new gold-tin plating line provides completely integrated in-house ability to economically produce high-quality laser diode submounts with Zero Pullback copper metallization and selective gold-tin finish. (Photo: Remtec)

The gold-tin plating process production, statistical process controls and quality control equipment have raised the company’s quality levels. Its quality control equipment includes x-ray fluorescence, energy dispersive x-ray fluorescence and a spectrophotometer, which allows for fast, accurate control and record of critical parameters such as gold-tin composition and thickness distribution.

Its plating line includes gold-tin alloys with compositions varying from 72/28 to 80/20, with thickness specified between 3 and 50 µm. Substrates are available with multiple metallization techniques and selective plating options that permit both silver thick-film and TiW thin-film seed layers of various thicknesses, plated copper from 5 to 75 µm and NiAu finish with gold thickness from 0.1 to 2.5 µm. Ceramic and copper surface finishes also are available and can be held to <1 µm.

Remtec provides custom and semicustom ceramic packaging based on plated copper and thick film (PCTF) technology.

For more information, visit:

The emission of light or other electromagnetic radiation of longer wavelengths by a substance as a result of the absorption of some other radiation of shorter wavelengths, provided the emission continues only as long as the stimulus producing it is maintained. In other words, fluorescence is the luminescence that persists for less than about 10-8 s after excitation.
An instrument for measuring spectral transmittance or reflectance.
AmericasBusinessceramic surfacecopper metallizationenergy dispersive x-ray fluorescencefluorescencegold thicknessgold tingold-tin platinglaser diode submountsmetallizationpackaging componentsPCTFplated copperplated copper & thick film technologyplatingplating process productionRemtecRemtec Inc.seed layerssilver thick filmspectrophotometersubstratethicknessthickness distributionTiW thin filmx-rayx-ray fluorescenceZero Pullbacklasers

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