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Rockwell Scientific to Refine FPA Manufacturing
May 2003
THOUSAND OAKS, Calif., May 5 -- Rockwell Scientific Co. has received a $15.5 million contract from the US Army Communications-Electronics Command and Night Vision and Electronic Sensor Directorate to improve production technology for third-generation infrared sensors, as part of the Army's dual-band focal plane array manufacturing program. Rockwell Scientific will develop improved manufacturing processes for large-format, small pixel, dual-band (two-color) infrared focal plane arrays (FPAs) at its new Camarillo production facility, with the goal of reducing the cost per unit tenfold.

Rockwell Scientific will lead a team that includes CMC Electronics Cincinnati, Ohio, and Jazz Semiconductor in Newport Beach.

"This award enables us to build upon many technologies pioneered at Rockwell Scientific over the last 15 years, particularly our HgCdTe molecular beam epitaxy growth capability and our more recent success in large-area dual-band FPA technology," said Jeff Johnson, program manager and project leader at Rockwell Scientific.

For more information, visit:

CMC ElectronicsCommunicationsfocal plane arrayindustrialinfrared sensorsJazz SemiconductorNews & FeaturesRockwell ScientificSensors & Detectors

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