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Rudolph Wins Order for Inspection System

Photonics Spectra
Sep 2011
Rudolph Technologies Inc. has received from an integrated circuit manufacturer the first order for its NSX 320 automated macro defect inspection system, designed for advanced packaging processes that use through silicon vias (TSVs) to connect multiple die in a single package. The system provides inspection capabilities for edge-trimming metrology, wafer alignment during bonding processes, sawn wafers on film frames and other TSV-related processes. It incorporates proprietary XSoft system software capabilities, including high-speed staging, on-the-fly image capture, and a range of sensor and objective options.

The science of measurement, particularly of lengths and angles.
Americasautomated macro inspection systembonding processesbumpingBusinessdata analysis systemdefect detectiondefect inspectiondicingedge-trimming metrologyfilm framesIC manufacturerimage captureimaginginspection systemintegrated circuit manufacturinglight speedmacro defect inspectionmetrologymicroelectronicsNew JerseyNSX 320NSX seriesobjectivespackaging processesprobingprocess control metrologyRudolph Technologiessawn waferssemiconductorsSensors & DetectorsSoftwarestagingTest & Measurementthrough silicon viasTSVwafer alignmentwafer manufacturingXSoft system software

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