Rudolph Wins Order for Inspection System
Rudolph Technologies
Inc. has received from an integrated circuit manufacturer the first order for its
NSX 320 automated macro defect inspection system, designed for advanced packaging
processes that use through silicon vias (TSVs) to connect multiple die in a single
package. The system provides inspection capabilities for edge-trimming metrology,
wafer alignment during bonding processes, sawn wafers on film frames and other TSV-related
processes. It incorporates proprietary XSoft system software capabilities, including
high-speed staging, on-the-fly image capture, and a range of sensor and objective
options.
https://www.photonics.com/Buyers_Guide/Rudolph_Technologies_Inc/c12952