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Rudolph to Fulfill $11M Wafer-Level Packaging System Order

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WILMINGTON, Mass., July 4, 2016 — Defect inspection, lithography, metrology, and process control software developer Rudolph Technologies Inc. said it has received a multisystem order for its fan-out wafer level packaging (FOWLP) system from an outsourced assembly and test firm in Asia. The order is valued at $11 million.

The order consists of multiple process control inspection systems and a yield-management software suite, and will be deployed into multiple applications including whole wafer inspection, 3D bump metrology and post-saw die inspection. The systems will begin shipping in the second quarter of 2016, with the majority of the order shipping in the second half of 2016.
Jul 2016
process control
The collection and analysis of data relevant to monitoring the rate and quality of industrial production, either continuously or in batches. Corrections can be made manually or automatically, via a feedback control loop.
The science of measurement, particularly of lengths and angles.
BusinesscontractsindustrialAmericasAsia-PacificMassachusettsRudolphinspectionFOWLPpackagingSoftwareprocess controlTest & Measurementmetrology

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