The SEMI Silicon Photonics Industry Alliance (SiPhIA) has launched three special interest groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization. The SIGs span system design and component manufacturing to packaging and testing. The first group, “SIG 1: System, Subsystems, and Silicon Photonics Development,” focuses on the future development trends in silicon photonics technology, including the design, manufacturing, and integration of silicon photonics chips, to form a complete silicon photonics ecosystem. The second group, “SIG 2: Advanced Packaging and Testing,” focuses on heterogeneous integration and co-packaged optical application packaging and testing technologies, to drive optical-electronic integration. The third group, “SIG 3: Equipment and Others,” is dedicated to developing and providing key equipment and technologies needed for the silicon photonics industry, focusing on process automation, including assembly, inspection technologies, and related equipment and innovative applications. SiPhIA announced the formation of the groups during its Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar event held earlier this month.