Search
Menu
Meadowlark Optics - SEE WHAT

SMIC Achieves Sensor Breakthrough

Facebook X LinkedIn Email
Semiconductor Manufacturing International Corp. (SMIC) has announced a breakthrough in its development of backside-illuminated CMOS image sensor (CIS) technology for mobile phone cameras, with the first test chip demonstrating good image quality even in low-light conditions.

The complete backside-illuminated (BSI) process development allows SMIC to broaden its CMOS image sensor foundry service offerings to customers with 5-megapixel and higher resolution phone cameras and high-performance video camera products. The company says that BSI sensors are more light-sensitive than frontside-illuminated CMOS sensors, allowing smartphones to take brighter, crisper images at night or indoors.

The company plans to soon begin early development of next-generation CIS technology based on 3-D integrated circuits.

The BSI technology is targeted to enter risk production with partnering customers in 2013.

For more information, visit: www.smics.com
Hamamatsu Corp. - Earth Innovations MR 2/24

Published: January 2013
Asia-Pacificbackside-illuminated CMOS image sensorsBSIBusinesscamerasChinaCIS technologyCMOSfrontside-illuminated CMOS sensorsimage sensorsImagingindustrialSemiconductor Manufacturing International Corp.Sensors & DetectorsShanghaismartphone imagesSMIC

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.