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SUSS MicroTec Sells Wafer Bonder
Feb 2009
In Germany, MST.factory dortmund of Munich, which provides support for companies in the micro- and nanotechnology fields, has purchased a CB8 high-performance wafer bonder from SUSS MicroTec of Garching. The device is being used to develop processes for state-of-the-art advanced MEMS wafer bonding techniques, particularly for Cu-Cu, Au-Au and Al-Al. The CB8 was chosen for its ability to run eutectic, fusion and metal diffusion processes, among others.

The material that has the lowest possible constant melting point of any possible combination of the same components.
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
Al-AlAu-AuCB8Cu-Cuenergyeutecticmetal diffusionMST.factory dortmundNews BriefsphotonicsPhotonics Tech BriefsSuss MicroTecwafer bonder

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