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Sensonor to Present at SPIE’s DSS
Mar 2010
HORTEN, Norway, March 18, 2010 – Sensonor Technologies AS, a developer of uncooled infrared (IR) sensors for thermal-imaging cameras, is slated to present a paper at the upcoming SPIE Defense, Security and Sensing conference on its achievements in the area of design and fabrication.

The talk, titled “High-performance long wave infrared bolometer fabricated by wafer bonding,” will be given by Adriana Lapadatu, senior engineer at Sensonor. According to Lapadatu: “A novel microbolometer with peak responsivity in the long-wave infrared region of the electromagnetic radiation is under development. It is a focal plane array of pixels with a 25-µm pitch, based on monocrystalline Si/SiGe quantum wells as IR-sensitive material.”

“The novelty of the proposed 3-D process integration comes from the choice of several of the materials and key processes involved, which allow a high fill factor and provide improved transmission/absorption properties,” she continued. “Together with the high temperature coefficient of resistance (TCR) and low 1/f noise provided by the thermistor material, they will lead to bolometer performances beyond those of existing devices.”

The conference will take place April 5 to 9 in Orlando, Fla.

For more information, visit:  

A thermometric instrument used for the detection and measurement of radiant energy. Its essential component is a short narrow strip covered with a dead black absorbing coating and mounted at the lower end of a long cylindrical tube having a stop across it to exclude unwanted radiation. The electrical resistance of the strip changes with the changes in temperature that arise from absorbing varying amounts of radiant energy.
A crystalline semiconductor material that transmits in the infrared.
Adriana LapadatuAmericasbolometercamerasdefenseDefense Security and SensingEuropeFloridagermaniumimaginginfrared sensorMEMSmicrobolometersMiddle EastOrlandoquantum wellsSensonor TechnologiesSensors & DetectorssiliconSPIETCRtemperature coefficient of resistancethermal imaging camerawafer bonding

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