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Suss Bonding System Chosen for Infotonics' MEMS Center
Mar 2007
Microelectromechanical systems (MEMS) wafer-bonding solutions provider Suss MicroTec of Munich, Germany, announced today that Infotonics has selected the company's ABC200 wafer-bonding cluster tool and FC150 device bonder for its MEMS packaging lab. "The ABC200 will allow automated precision alignment, cleaning, bonding and inspection all in one system. The ABC200 cluster tool modularity allows us to run a variety of bonding processes for both R&D and pilot production," said Nancy Stoffel of the Infotonics Technology Center. The FC150 provides development and pilot production capabilities for flip chip processes. The Infotonics Technology Center was formed in 2001 by Eastman Kodak Co., Corning Inc. and Xerox Corp. as a nonprofit corporation to operate New York State's Center of Excellence in Photonics and Microsystems. It is located in Canandaigua, N.Y., and provides R&D on photonics, MEMS and MOEMS (micro-optoelectromechanical systems) to the biomedical and communications industries.

flip chip
An optical switch that controls conduction paths into and out of a junction in fiber optic and integrated optical circuits.
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
ABC200BiophotonicsCommunicationsCorningfiber opticsflip chipinfotonicsKodakMEMSmicroelectromechanical systemsMicrosystemsMOEMSNews BriefsphotonicsPhotonics SpectraPhotonics Tech BriefsSuss MicroTecwafer bondingXerox

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