Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
share
Email Facebook Twitter Google+ LinkedIn Comments

Two-Photon Imaging Offers Backside Peek at Chips

Photonics Spectra
Jul 1997
Single-photon, optical beam-induced- current imaging is a valuable tool for the quality control of integrated circuits. However, this technique has become increasingly ineffective because of the large number of layers added to the front side of the modern chip. Scientists at Bell Laboratories in Murray Hill, N.J., have developed a two-photon process that can image through the back side of a chip without thermal absorption. In the process, a mode-locked Ti:sapphire laser "blasts" and polishes the back end of the chip. The team could view the components of a Hitachi 256 3 4k SRAM chip at around 10 µm, whether it was powered or not.

Research & TechnologyTech Pulse

Comments
Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, info@photonics.com

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.