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VI Systems Begins Shipping Circular VCSEL Arrays

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BERLIN, Aug. 16, 2010 — VI Systems GmbH has released the first circular chip arrays of its vertical cavity surface emitting laser (VCSEL) designed for wire- and flip-chip bonding.

With seven channels for data rates of up to 5 Gbit/s per channel, the VCSEL delivers an operating wavelength of 850 nm and is available in a ringlike 6 + 1 channel configuration with one emitter in the center.

It is suitable for short and very short reach optical receivers and transceiver modules used in optical communication networks, as well as chip-to-chip optical interconnects in the computer industry.

VI Systems is a fabless developer and manufacturer of optoelectronics components for communication, industrial and consumer applications.

For more information, visit:
Aug 2010
A source of radiation.
Pertaining to optics and the phenomena of light.
A sub-field of photonics that pertains to an electronic device that responds to optical power, emits or modifies optical radiation, or utilizes optical radiation for its internal operation. Any device that functions as an electrical-to-optical or optical-to-electrical transducer. Electro-optic often is used erroneously as a synonym.
An instrument or system capable of both transmitting and receiving a signal.
bondingBusinesschannelchannel configurationchip-to-chipCommunicationsConsumeremitterEuropefablessflip-chip bondingGbitindustrialinterconnectoperating wavelengthopticaloptical communication networkoptical interconnectsoptical receiveropticsoptoelectronicstransceiverVCSELvertical cavity surface emitting laserVI SystemsVI Systems GmbHwire bondinglasers

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