VI Systems Begins Shipping Circular VCSEL Arrays
BERLIN, Aug. 16, 2010 — VI Systems GmbH has released the first circular chip arrays of its vertical cavity surface emitting laser (VCSEL) designed for wire- and flip-chip bonding.
With seven channels for data rates of up to 5 Gbit/s per channel, the VCSEL delivers an operating wavelength of 850 nm and is available in a ringlike 6 + 1 channel configuration with one emitter in the center.
It is suitable for short and very short reach optical receivers and transceiver modules used in optical communication networks, as well as chip-to-chip optical interconnects in the computer industry.
VI Systems is a fabless developer and manufacturer of optoelectronics components for communication, industrial and consumer applications.
For more information, visit: www.v-i-systems.com
https://www.photonics.com/Buyers_Guide/VI_Systems_GmbH/c18309