Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics Spectra BioPhotonics EuroPhotonics Vision Spectra Photonics Showcase Photonics ProdSpec Photonics Handbook
More News

Wafer Bonding Agreement

Facebook Twitter LinkedIn Email Comments
3M of St. Paul, Minn., an advanced materials supplier for the semiconductor industry, and Tazmo Co. Ltd. of Okayama, Japan, an LCD manufacturing equipment and semiconductor supplier, have announced an agreement allowing the latter company to manufacture and sell equipment for temporary bonding of ultrathin wafers required for 3-D packaging. Under terms of the agreement, Tazmo will become a supplier for equipment configured to use 3M’s wafer support system materials, including the Liquid UV-Curable adhesive and the Light-to-Heat conversion coating. Both companies also will work together to address customer demands for high-performance process solutions.

Photonics Spectra
Mar 2010
3-D packaging3Madhesive.bondingBusinesscoatingsDisplaysindustrialJapanLCDlight speedLight-to-Heat convesrion coatingLiquid UV-Curable adhesivesemiconductorTazmo Co. Ltd.Test & Measurementultrathin wafersWafers

Comments
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2019 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA, info@photonics.com

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.