Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
Email Facebook Twitter Google+ LinkedIn Comments

Wafer Bonding Shipment

Photonics Spectra
Apr 2010
Wafer bonding and lithography equipment supplier EV Group of St. Florian, Austria, has shipped two wafer bonding systems to the University of Michigan’s Lurie Nanofabrication Facility, a center for microelectromechanical systems (MEMS) and microsystems research and a member of the National Nanotechnology Infrastructure Network. The new systems will provide high-force wafer bonding capabilities to increase the level of the university’s MEMS research efforts.

AustriaBusinessEV Groupindustriallight speedlithographyLurie Nanofabrication FacilityMEMSmicroelectromechanical systemsmicrosystems researchNational Nanotechnology Infrastructure NetworkTest & MeasurementUniversity of Michiganwafer bondingwafer bonding systemWafers

Terms & Conditions Privacy Policy About Us Contact Us
back to top
Facebook Twitter Instagram LinkedIn YouTube RSS
©2018 Photonics Media, 100 West St., Pittsfield, MA, 01201 USA,

Photonics Media, Laurin Publishing
x Subscribe to Photonics Spectra magazine - FREE!
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.