Photonics ProductsOptics & Optical FabricationOptical Fabrication AccessoriesAdhesives
UNIBOND 5.0 Thermoplastic Adhesive
About Universal Photonics Inc.- Type: Adhesives
- Color: Purple
- Penetration Test (in): < 0.004
- Softening Point (°C): 51 - 59
- Melting Point (°C): 55 - 63
- Size Availability: Bulk, 2 Bars, Each
The UNIBOND Series of water soluble, thermoplastic adhesives is engineered for temporary bonding and blocking processes in a wide range of metals and ceramics, delivering superior adhesion strength and performance. UNIBOND 5.0 has the lowest melting and bonding temperature in the Series. Most commonly used in lapping, back grinding, wafer bonding, blocking and wafer thinning processes.
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