Search
Menu
Bristol Instruments, Inc. - 872 Series LWM 9/25 LB
Photonics ProductsLasersLasers & Laser SystemsSemiconductor

microDICE™

About 3D-Micromac AG

  • Type: Semiconductor

This system leverages TLS-Dicing™ (thermal laser separation) – a technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with excellent edge quality while increasing manufacturing yield and throughput.

microDICE™

We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.